SEPARATOR PLATE

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SUS 630
  • 630 series, for precision lamination

  • Exceptional heat treatment, scratch-resistant, high hardness

  • With Nickel, corrosion-resistant, pinhole-free

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Hitec
  • S4 and Mp2 series, for Multi-layer and HDI board

  • High TCE close to copper, better resistance to copper wrinkling

  • Provide 0.5 mm thickness, increase product capacity

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Anodize Plus
  • 6160 Alloy, for Adara press

  • Superior anodized layer, high reliability

  • Anodized gap-free, high performance of insulation